JPS607741A - 混成集積回路装置 - Google Patents
混成集積回路装置Info
- Publication number
- JPS607741A JPS607741A JP11551383A JP11551383A JPS607741A JP S607741 A JPS607741 A JP S607741A JP 11551383 A JP11551383 A JP 11551383A JP 11551383 A JP11551383 A JP 11551383A JP S607741 A JPS607741 A JP S607741A
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- heat dissipating
- dissipating plate
- metal layer
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 238000007789 sealing Methods 0.000 claims abstract description 4
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
- H01L2924/1617—Cavity coating
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11551383A JPS607741A (ja) | 1983-06-27 | 1983-06-27 | 混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11551383A JPS607741A (ja) | 1983-06-27 | 1983-06-27 | 混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS607741A true JPS607741A (ja) | 1985-01-16 |
| JPH0354470B2 JPH0354470B2 (en]) | 1991-08-20 |
Family
ID=14664378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11551383A Granted JPS607741A (ja) | 1983-06-27 | 1983-06-27 | 混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS607741A (en]) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0209642A3 (en) * | 1985-07-25 | 1987-04-15 | Hewlett-Packard Company | Ceramic microcircuit package |
| US5791164A (en) * | 1996-06-17 | 1998-08-11 | Milliken Research Corporation | Outdoor sporting fabric |
| US7002803B2 (en) | 2002-02-27 | 2006-02-21 | Nec Compound Semiconductor Devices, Ltd. | Electronic product with heat radiating plate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6692700B2 (en) | 2001-02-14 | 2004-02-17 | Handylab, Inc. | Heat-reduction methods and systems related to microfluidic devices |
-
1983
- 1983-06-27 JP JP11551383A patent/JPS607741A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0209642A3 (en) * | 1985-07-25 | 1987-04-15 | Hewlett-Packard Company | Ceramic microcircuit package |
| US5791164A (en) * | 1996-06-17 | 1998-08-11 | Milliken Research Corporation | Outdoor sporting fabric |
| US7002803B2 (en) | 2002-02-27 | 2006-02-21 | Nec Compound Semiconductor Devices, Ltd. | Electronic product with heat radiating plate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0354470B2 (en]) | 1991-08-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5371404A (en) | Thermally conductive integrated circuit package with radio frequency shielding | |
| KR100590382B1 (ko) | 전자 패키지 및 이의 제조 방법 | |
| JP3982876B2 (ja) | 弾性表面波装置 | |
| US6617686B2 (en) | Semiconductor device and method of isolating circuit regions | |
| TWI605564B (zh) | 封裝結構及其製法 | |
| US10553954B2 (en) | Wireless device | |
| CN206835541U (zh) | 板级屏蔽件、电子装置、系统级封装模块和屏蔽模块 | |
| US5831324A (en) | Electromagnetic wave suppression method in a semiconductor manufacturing process | |
| JPH1187977A (ja) | ケーシング内に配列された電気回路構成 | |
| JPS607741A (ja) | 混成集積回路装置 | |
| JPS6286841A (ja) | 高周波混成集積回路 | |
| JPH08204377A (ja) | 遮蔽体 | |
| US3193707A (en) | Radio frequency shielded controlled rectifier | |
| WO2002043135A1 (en) | Semiconductor device and its manufacturing method | |
| JP2001035957A (ja) | 電子部品収納用パッケージならびに半導体装置およびパッケージ製造方法 | |
| WO2019207657A1 (ja) | 半導体装置および半導体装置の製造方法 | |
| JP2003031987A (ja) | 電磁界遮蔽キャップ | |
| JPH1140709A (ja) | 半導体実装構造およびその製造方法 | |
| JP2000183488A (ja) | ハイブリッドモジュール | |
| JP2002158317A (ja) | 低ノイズ放熱ｉｃパッケージ及び回路基板 | |
| JP3127645B2 (ja) | パッケージ構造 | |
| EA001814B1 (ru) | Однокристальный модуль интегральной схемы | |
| JPH0412035B2 (en]) | ||
| JPH03179796A (ja) | ハイブリッド集積回路 | |
| JP2000165086A (ja) | 電子部品容器 |